The electronic packaging industry is developing fast and facing increasing standards of productivity and product quality. Products are becoming increasingly more compact and challenging to manufacture. A particular challenge in recent times has been the EU directive on waste electronic equipment (WEE), banning the use of lead in electronic solders. Lead-free soldering sets higher requirements on control during the soldering process.
In our SOLDERFLEX® product family we offer industrial gas-based solutions for process improvements through electronic soldering and related process steps. There are nitrogen soldering solutions for improved productivity for both reflow and wave soldering machines.
For wave soldering we offer professional nitrogen retrofit SOLDERFLEX® LIS which has:
- A wider process window
- Improved wetting
- Improved solder joint quality
- Reduced number of defects such as opens, bridges and others; less reworking
- Dross reduction up to 90% and reduced solder consumption (for wave soldering)
- Reduced maintenance
We also offer:
- Process optimization of nitrogen soldering, including soldering atmosphere measurements and optimization of nitrogen flow
- Inert storage solutions for components - SOLDERFLEX® LIS
- Complete inert atmosphere cabinets solutions to store components safe from exposure to oxygen or moisture
- Low temperature testing solutions - SOLDERFLEX® CT
- Fast ramping rates to generate required thermal stresses
- Reaches low temperatures, down to -150°C if required
- Compact and efficient system
- Dry precision cleaning systems for components, based on carbon dioxide snow.
- Low pressure (non-thermal) plasma treatment solutions for improved solderability by cleaning, activating, reducing and etching the surfaces to be joined.